烧结银 无压烧结银 有压烧结银 烧结型银膜 烧结纳米银浆 可拉伸导电油墨 导电胶 低温导电银浆 可焊接银浆
Pressureless Silver Sintering Pastes Die-Attach for SiC Power Devices
SHAREX’s silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These mission profiles typically drive longer high-temperature operating life (HTOL) and larger temperature swings in usage (thermally cycling).
SHAREX'S Silver Sintering Pastes Features & Benefits
Proven fast sintering with excellent joint strength
Pressureless sintering solution with pressurized sintering capabilities
Controllable bondline thickness from 30-70µm
Versatile sintering profiles
SHAREX‘s Silver Sintering pastes advantage
Highest electrical conductivity
High thermal conductivity
Higher than Cu
High temperature applications
Less reactive than Cu